Wafer Cleaning And Packaging
Wafer Cleaning Equipment:
The main function of this equipment is to carry out the basketless cleaning process for traditional mortar cutting and diamond wire cutting silicon wafers.
Cleaning silicon wafer: 166*166mm
- Maximum throughput per batch: 480 tablets
- Beat: 160-300 seconds (user can design)
- Film box: 120 pieces, 4 boxes per slot
- Handling maximum weight: 80kg