Brick Inspection

Raise the efficiency of your production

From the silicon raw material, crystal ingots are grown, which are sawn into the silicon blocks. It is reasonable to sort out faulty parts as soon as possible or, even better, to avoid processing them. Our ORION silicon block inspection systems offer a fully automated solution for inspection prior to the two process steps of polishing and wafer sawing:

• The ORION NIR inspection generates cutting recommendations for the wafer sawing process. With knowledge of the inclusions in the material, a suitable process solution can be found.
• The ORION 3D geometry measurement system generates recommendations for the polishing system to reduce the polishing effort.

The automatic inspection of silicon blocks is suitable for continuous automated production and for manual operation as a stand-alone system, e.g. for the laboratory. It is possible to combine the two systems into one machine.

 

Ingot Inspection

Vertical Diamond wire squaring Cutting machine for single silicon Rod

Features :

• The loading and unloading of double station automatic completion, automatic delivery for offcut.
• Provide a universal scanning gun hardware connection interface and another data interface for factory automation.
• Computer interface monitors coolant flow temp.,motor temp. & torque, also the tension and wire consumption and so on information in real-time.
• Automatic loading & unloading integrative design and automatic operation of the entire process.

 

Single And Multi Wire Saw

Features:

• Long cutting size, double station automatic loading and unloading & automatic crystal rod cleaning.
• New floating support structure ensuring cutting quality & stable operation of equipment.
• Long processing silicon rod length,9 cutting positions automatic adjustment & flexible cutting length setting.
• Servo motor control tension, stable & reliable, low calibration frequency.

 

Wafer Cleaning And Packaging

Wafer Cleaning Equipment:

The main function of this equipment is to carry out the basketless cleaning process for traditional mortar cutting and diamond wire cutting silicon wafers.

Cleaning silicon wafer: 166*166mm

• Maximum throughput per batch: 480 tablets
• Beat: 160-300 seconds (user can design)
• Film box: 120 pieces, 4 boxes per slot
•  Handling maximum weight: 80kg

 

Grinding Polishing And Chamfering Machine

Description:

Combination grinding machine for monoblocks (round chamfer) and Multi blocks (45 ° chamfer) and grinding of the surface. Designed for manual or automatic assembly via robots.

Features :

• Low cycle time because of 80 % higher cutting speed(90m/s)
• Optional Loading and unloading station, manual or with robot
• Auto calibration
• Reduction of maintenance services and spare parts