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1. Bunching / Stranding / shapping of Conductor:

• Dai and No. of Strands.: On Smaple Basis,
• Conductor Resistance.: Sampling Basis.
• Direction Abd Lay Length.: Sampling Basis.
• Dimension over Conductor.:Sampling Basis.

2. Insulation Extrusion

• On line spark Tester: 10% Performed by Spark Testers on each Extruded.
• Dimension and Centering: On line, by sampling basis.
• Insulation Resistance: Sampling Basis.
• High Voltage: Sampling Basis.
• Tensile Strength of Comp: Sampling BasisPerformed as described before.
• Conductor Dimension: Sampling Basis And Resistance.
• Shrinkabge: Sampling Basis.

3. Twisting And Laying of Cores.

• Visual Examination for: 100% Color Sequence
• Direction And Lay LEngth: 100% Performed with High Voltage Test.
• High Voltage Test: 100% performed with High voltage Test.
• Conductor Resistance: 100% on Digital Resistance Meter.
• Size of Conductor: 100% by Micrometer.
• Dia. Over Laid UP Cores: 100% by Vernier Calipers.

4. Inner Sheath.

• Thickness And Measurement: 100% Color Sequence.
• Surface Conditions of Inner: Visual Examination. Sheath

5. Armouring

• Direction of Lay: Visual Examination.
• No. Of Wires/Strip: On line, by counting.
• Diameter Of Wire / Width: By Micrometer And Thickness of Strip.
• High Voltage: 100% By High Voltage Tester
• Dia. Ovreer Armouring: By Vernier Calipers.

6. Sheathing

• Continuity of Each Core before Sheating: 100% By continuity Tester.
• Diameter Over Sheathing: By Vernier Calipers.
• Thickess of Insulation: by Vernier Calipers.
• Eccentricity : By Vernier Calipers.
• Surface Finish: Visual Examina.