Plating Tool Multiplate

MultiPlate®: Atotech’s first semiconductor plating tool addresses future industry requirements such as cost effectivity and superior process performance for manufacturing of electrochemical packaging solutions. MultiPlate® is designed for single and double sided plating, through hole filling and high speed pillar plating. The tool is compatible with both wafer and panel size substrates (silicon, glass, etc.) and can be customized according to the individual production requirements.