Desmear and metallization
Integrated wet chemical solutions for all key market segments including IC substrates, HDI/MLB and Flex/Flex-Rigid

Quick facts

Global market leader for horizontal high end HDI manufacturing
Worldwide market reference for desmear processes in all market segments
Over 100 vertical and 230 horizontal lines are running in mass production with our electroless copper processes

Applications

Desmear
Horizontal electroless copper
Vertical electroless copper
Direct plating
Metallization of glass substrates

Panel and pattern plating
Complete solutions for all aspects of package substrate and HDI production

Quick facts

Electrolytic plating for the highest requirements in reliability and productivity
Solutions for various equipment types: Uniplate® IP2, vertical conveyorised lines, conventional hoist type
Market leading Uniplate® IP2 equipment for horizontal conveyorized production

Applications

Conformal plating
BMV filling
TH filling
Pretreatment
Metal resist, electrolytic final finishes

Final finishing
Coping with the harsh environment of multiple Pb-free soldering
with a complete line of final finishes

Quick facts

Highest global market share for final finishing
Complete portfolio of final finishes
Production proven lead free processing
OEM relevant development

Applications

ENIG
ENEPIG
EP/EPAG
Immersion Tin

Multibond®: This Black Oxide process can be operated over a wide range of temperatures and dwell times to produce a variety of bonding properties, depending on the specific applications.
BondFilm®: Atotech’s simple and economic oxide alternative process for improved inner layer bonding. With over 400 lines and installations worldwide Atotech leads this market segment globally and contributes to the success of many key PCB manufacturers.
Secure HFz: A non-etching adhesion promoter that achieves better or comparable performance to existing etch-based enhancement processes that specifically targets IC-Substrates and high frequency applications. Secure HFz ensures enhanced bonding between copper layers and the dielectric materials used in multilayer and chip carrier manufacture. This results in excellent peel strength while also providing resistance against chemical attack.

Enabling technology for direct metal deposition on molding resin: Booster® MR is a unique wet-chemical adhesion enhancement process for primer-less metal plating directly on molding resins. Direct plating on molding resin enables applications for conformal electromagnetic interference (EMI) shielding and “direct circuit formation” on molding resins, such as for FO WLP (FO PoP, FO SiP). The Booster® MR process can handle singulated and strip based products, using tape carriers to prevent the I/O side from being attacked by the plating solutions.

MultiPlate®: Atotech’s first semiconductor plating tool addresses future industry requirements such as cost effectivity and superior process performance for manufacturing of electrochemical packaging solutions. MultiPlate® is designed for single and double sided plating, through hole filling and high speed pillar plating. The tool is compatible with both wafer and panel size substrates (silicon, glass, etc.) and can be customized according to the individual production requirements.

Equipment highlights:

High quality stainless steel sweller and permanganate modules ensure maximum process stability and low maintenance
Integrated stainless steel filtration system for sweller and permanganate
Designed to save resources – Chemical regeneration system for continuous production at stable process parameters (Oxamat® for permanganate regeneration) and sophisticated rinse concept
Strong process performance with flood bar technology