Bonding Enhancement

Multibond®: This Black Oxide process can be operated over a wide range of temperatures and dwell times to produce a variety of bonding properties, depending on the specific applications.
BondFilm®: Atotech’s simple and economic oxide alternative process for improved inner layer bonding. With over 400 lines and installations worldwide Atotech leads this market segment globally and contributes to the success of many key PCB manufacturers.
Secure HFz: A non-etching adhesion promoter that achieves better or comparable performance to existing etch-based enhancement processes that specifically targets IC-Substrates and high frequency applications. Secure HFz ensures enhanced bonding between copper layers and the dielectric materials used in multilayer and chip carrier manufacture. This results in excellent peel strength while also providing resistance against chemical attack.