Copper plating is the process in which a layer of copper is deposited on the item to be plated by using an electric current.Copper is an active metal and so difficult to plate onto a passivated surface, making direct plating of iron based metals difficult. Such surfaces often require a nickel strike base coat for the copper to adhere to. The plating seen in chemistry classes, often obtained with a coin and copper sulphate bath, is in fact deposition as opposed to plating. Subjecting the surface to any wear causes the unstuck deposit to come away. Running such a bath for longer periods, one can often see the grainy like texture of deposition as opposed to the smooth surface of plating. Commercial platers often use a copper cyanide-based solution to ensure a high level of copper remains in solution.