At NICA we understand the quality of the product is important to our client’s success and as such we offer a range of coating solutions including roller coating, electrostatic spraying, low pressure air spray, via hole filling, screen printing, customized coating solutions and more.

Our technologies can be adopted for Printed circuit boards, ball grid array, touch panel, LED, IC Substrate, Optoelectronics, automotives, aerospace and semi conductors industries.

Popular option for solder masking. Equipped with latest (butterfly) electrostatic spray gun with max rpm of 5000 and specially designed suspension clamp, fast paced production is ensured.

Along with superior spray coverage as electrostatic spraying technology is suitable for work piece with >0.4mm thickness. This technology also leds to low raw material wastage.

No spray deposition accumulated onto through-hole , no blocked holes after spraying.

Auto or semi auto , our screen printer has features such as CCD camera with high precision and alignment to ensure ink spread uniformity.
 

Description / Specification of Screen Printing

We are involved in offering a wide range of Screen Printing to our most valued clients. Our range of these are widely appreciated by our clients which are situated all round the nation. We offer our range of it at most affordable prices.

We introduce ourselves as an eminent trader and supplier of an extensive array of  Screen Printing. Prior to dispatch, our quality controllers run numerous tests on the entire range on various parameters of quality and durability. The offered equipment is manufactured using superior quality components with the aid of sophisticated techniques at the vendors' end. Moreover, our precious clients can purchase it in different technical specifications at reasonable price from us within promised time frame.
Features:

Sturdy design
Highly durable
Application specific design 

Designed to fill holes in substrate with conductive or non conductive paste. And equipped with glass cover for safety and visual quality control, both side of panels can be fill in one cycle.

To ensure quality, the system automatic scavenger system will remove excess plugging paste from the surface of the printed circuit board. Once again, it is equipped with glass cover for safety and visual quality control

At NICA we offer various drying system solutions with different heating source which can be employed for Printed circuit boards, ITO film, touch panel, LED, IC Substrate, Optoelectronics, automotives, aerospace and semi conductors industries. Our drying system has also cooperated with world leading 3C products manufacturer.

We fully understand that each client has its own unique requirements and with our in depth knowledge of the applications and industries, our clients can be assured of turn key and customized coating and drying solutions.

Widely used in industries including automotive, electronics, substrate manufacturing. In UV curing, there is no solvent to evaporate, no environmental pollutants, no loss of coating thickness, and no loss of volume. With our patented lamps and specially designed reflectors, drying of coatings is achieved instantly with quality uniformity. Our drying system also incorporated energy saving lamp as such half lamp mode is activated depending on client’s time threshold.

Wide temperature range from 50 to 250℃, primary and secondary trolley design, Class 1000-5000 clean oven. Vertical wicket and clamping type tunnel oven

Infrared heating, a popular method used by industries due to it’s low heating time required. Down-flow (vertical downward suction) to prevent films from floating or scratched

Temperature range: 50-600 ℃. Applicable for glass high temperature sintering, glass bake in AR coating process.

Temperature range: AT~ 250℃, Oxygen content：100~50000 ppm (customizable), applicable for baking of PCB without oxidation

Temperature Range：AT~150℃,Conveying System：Circulating Levitating Rollers. Applicable for Baking of T/P Capacitive Film & RtoR Flexible Electronic Components

Temperature Range：AT~200℃, Conveying System：Levitating Plates. Applicable for Baking of T/P Capacitive Film & RtoR Flexible Electronic Components

Features
(1) Patent Lamp house for excellent UV energy uniformity (up to 90%)
(2) HMI system for easy operation and maintenance
(3) Customization

Conveying System Precisive Rollers & Levitating Plates. Applicable for baking of T/P Capacitive Film & RtoR Flexible Electronic Components

Automatic cut sheet laminator 
- Max. width: 25”
- Thickness: 0.05~3.2 mm
● Capacity
- 3 m/min for outer layer Process
- 2.5 m/min for inner layer Process
● Induction heater
- Up to 120 ± 3 ℃
● Outfeed temperature sensor
● Option: 1000 ft dry film

Vacuum Laminator System
-Max. width: 560mm
-Thickness: 0.1 ~ 3.0 mm
● Conveyor speed: 1~10m/min adjustable
● Heating temp.: 110℃ ± 5% (Max 130℃)
● Application
-ABF
-FPC
-Wafer fabrication

Our HMI allows panel conveyor size to be adjusted before transporting your product for air spray. Using pneumatic to generate spray, high operating efficiency is achieved.